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CC a high precision automatic solder paste screen printer designed for high precision screen printing or stencil printing in SMT industry. 2.Product Features： a) Wide spectrums for PCB sizes from 50mm x 50mm to 400mm x 340mm and PCB thickness from 0.6mm to 6mm. b) High printing accuracy
1.High positioning accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm. 2.Support glue printing
c) Automatic control improves production efficiency, quality control and cost saving: 1.Automatic stencil positioning
2.Automatic PCB calibration
3.Automatic adjustment of squeegee pressure
4.Automatic printing
5.Automatic stencil cleaning (dry-type, wet-type and vacuum-type) d) Adopt company independently developed suspended print head and automatic pressure adjustment system. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste. e) Programmable motor controls separation speed and distance among the squeegee, stencil and substrates, to realize multi-method separation. f) Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning. g) Upward and downward visual positioning. h) Built-in image processing system
i) Support 2D,SPC functions
3.Applicable pitches of Components
a) SMT Components such as resistors, capacitors, inductors, diode and triode: 01005, 0201, 0402, 0603, 0805, 1206 and other specifications. b) IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm; c) Printing size：50mm x 50mm ~400 mm x 340 mm
d) PCB Thickness: 0.6mm ~ 6mm
e) FPC Thickness: thickness≦ 0.6 mm (excluding jig)
4.Applicable PCB Types
Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products
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Fully Automatic Solder Paste Printer
